Research Area
Fuel Cell/Electrolysis
Our hydrogen energy research focuses on advancing solid oxide cell (SOC) technologies, including fuel cells (SOFC) and electrolysis systems (SOEC), through atomic-scale interface engineering and catalyst design. By integrating atomic layer deposition (ALD), infiltration, and exsolution strategies, we precisely tailor electrode surfaces and interfaces to enhance catalytic activity, stability, and durability under high-temperature operating conditions.
Recent work demonstrates significant progress in improving oxygen electrode performance via ALD-modified interfaces (e.g., CeO₂, ZrOₓ nanocoatings), as well as the development of high-performance thin-film anodes such as Ni-SDC systems for low-temperature operation. We further explore metal–oxide interactions, high-entropy perovskites, and exsolution-based catalysts to overcome key challenges including degradation, agglomeration, and surface poisoning. Through these approaches, our research aims to enable efficient hydrogen production and utilization with improved long-term stability and scalability for next-generation energy systems.
Battery
The growing demand for high-energy-density batteries in advanced applications such as EV, robotics, and drones has increased the need for reliable surface engineering strategies for Ni-rich cathode active materials. Although high-Ni single-crystal NCM cathodes are promising candidates for next-generation lithium-ion batteries, their electrochemical performance is often limited by surface instability and interfacial degradation during cycling.
We developed the first plasma-enhanced powder atomic layer deposition (ALD) platform to precisely engineer functional nano-coatings directly on cathode powders. Using this platform, complex ALD processes for multicomponent films were optimized, and the influence of oxidant chemistry was examined by comparing H2O-based thermal ALD and O2 plasma-based plasma ALD.
By synthesizing highly ion-conductive multi-component thin films (e.g., LiNbOx) and optimizing surface reaction chemistries, we effectively suppress interfacial degradation and enhance electrochemical stability during cycling. This unique powder ALD technology provides a precise and scalable manufacturing strategy to realize highly reliable, long-lasting lithium-ion batteries for next-generation energy applications.
The growing demand for high-energy-density batteries in advanced applications such as EV, robotics, and drones has increased the need for reliable surface engineering strategies for Ni-rich cathode active materials. Although high-Ni single-crystal NCM cathodes are promising candidates for next-generation lithium-ion batteries, their electrochemical performance is often limited by surface instability and interfacial degradation during cycling.
We developed the first plasma-enhanced powder atomic layer deposition (ALD) platform to precisely engineer functional nano-coatings directly on cathode powders. Using this platform, complex ALD processes for multicomponent films were optimized, and the influence of oxidant chemistry was examined by comparing H2O-based thermal ALD and O2 plasma-based plasma ALD.
By synthesizing highly ion-conductive multi-component thin films (e.g., LiNbOx) and optimizing surface reaction chemistries, we effectively suppress interfacial degradation and enhance electrochemical stability during cycling. This unique powder ALD technology provides a precise and scalable manufacturing strategy to realize highly reliable, long-lasting lithium-ion batteries for next-generation energy applications.
Capacitor
Our laboratory actively focuses on capacitor research for next-generation semiconductor device development. In particular, we concentrate on designing and fabricating high-performance, high-density capacitors using high-k dielectrics and metal electrodes.
At the core of our research is the development of ultrathin dielectric and electrode materials. Using deposition techniques such as Atomic Layer Deposition(ALD) and sputtering, we optimize ultrathin materials to achieve reliable, high-performance capacitors. We also conduct precise electrical characterization, including dielectric constant and leakage current to explore methods for improving device performance.
Based on these efforts, our laboratory investigates the application of high-k capacitors in advanced DRAM and other next-generation memory and logic devices. Ultimately, our goal is to develop high-performance capacitor technologies that can support device miniaturization and 3D architectures, contributing to the advancement of future electronic devices.
Our laboratory actively focuses on capacitor research for next-generation semiconductor device development. In particular, we concentrate on designing and fabricating high-performance, high-density capacitors using high-k dielectrics and metal electrodes.
At the core of our research is the development of ultrathin dielectric and electrode materials. Using deposition techniques such as Atomic Layer Deposition(ALD) and sputtering, we optimize ultrathin materials to achieve reliable, high-performance capacitors. We also conduct precise electrical characterization, including dielectric constant and leakage current to explore methods for improving device performance.
Based on these efforts, our laboratory investigates the application of high-k capacitors in advanced DRAM and other next-generation memory and logic devices. Ultimately, our goal is to develop high-performance capacitor technologies that can support device miniaturization and 3D architectures, contributing to the advancement of future electronic devices.
Nano Fabrication
Our nano-fabrication research centers on developing next-generation atomic-scale manufacturing technologies for energy devices, electronics, and photonic systems. We employ advanced techniques such as atomic layer deposition (ALD), atomic layer etching (ALE), and area-selective deposition to achieve precise control over material growth, interfaces, and nanostructures. These methodologies enable conformal coating on complex geometries and open new pathways for scalable nanomanufacturing.
Recent work spans a wide range of applications, including wafer-scale metalenses, hybrid metasurfaces, graphene-dielectric interfaces, and high-performance solid oxide cell (SOC) electrodes. In particular, we have demonstrated etch-free nanofabrication strategies and hybrid material integration for high-efficiency photonic devices, as well as ALD-enabled interface engineering for energy conversion systems. By integrating materials design with process innovation, our research aims to bridge the gap between nanoscale precision and industrial scalability.
Our nano-fabrication research centers on developing next-generation atomic-scale manufacturing technologies for energy devices, electronics, and photonic systems. We employ advanced techniques such as atomic layer deposition (ALD), atomic layer etching (ALE), and area-selective deposition to achieve precise control over material growth, interfaces, and nanostructures. These methodologies enable conformal coating on complex geometries and open new pathways for scalable nanomanufacturing.
Recent work spans a wide range of applications, including wafer-scale metalenses, hybrid metasurfaces, graphene-dielectric interfaces, and high-performance solid oxide cell (SOC) electrodes. In particular, we have demonstrated etch-free nanofabrication strategies and hybrid material integration for high-efficiency photonic devices, as well as ALD-enabled interface engineering for energy conversion systems. By integrating materials design with process innovation, our research aims to bridge the gap between nanoscale precision and industrial scalability.